Invention Grant
- Patent Title: Semiconductor integrated circuit
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Application No.: US14971461Application Date: 2015-12-16
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Publication No.: US09865601B2Publication Date: 2018-01-09
- Inventor: Kai-Chun Lin , Yu-Der Chih , Chia-Fu Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L27/105 ; H01L27/02

Abstract:
The present disclosure relates to a semiconductor integrated circuit. The semiconductor integrated circuit includes a substrate, a first transistor and a first patterned conductive layer. The first transistor has a source region, a drain region in the substrate and a gate region on the substrate. The first patterned conductive layer is electrically connected to the drain region of the first transistor. The first patterned conductive layer includes a first section, a second section and a fusible device.
Public/Granted literature
- US20170179131A1 SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2017-06-22
Information query
IPC分类: