Invention Grant
- Patent Title: Image sensor pickup region layout
-
Application No.: US15206061Application Date: 2016-07-08
-
Publication No.: US09865630B2Publication Date: 2018-01-09
- Inventor: Dun-Nian Yaung , Ching-Chun Wang , Feng-Chi Hung , Jeng-Shyan Lin , Yan-Chih Lu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/24
- IPC: H01L21/24 ; H01L27/146

Abstract:
Embodiments of the present disclosure include an image sensor device and methods of forming the same. An embodiment is an image sensor device including a first plurality of pickup regions in a photosensor array area of a substrate, each of first plurality of pickup regions having a first width and a first length, a second plurality of pickup regions in a periphery area of the substrate, the periphery area along at least one side of the photosensor array area, each of second plurality of pickup regions having a second width and a second length.
Public/Granted literature
- US20160322407A1 Image Sensor Pickup Region Layout Public/Granted day:2016-11-03
Information query
IPC分类: