Invention Grant
- Patent Title: Sputtering target, method for manufacturing the same, and method for manufacturing semiconductor device
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Application No.: US14530872Application Date: 2014-11-03
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Publication No.: US09865696B2Publication Date: 2018-01-09
- Inventor: Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2010-281429 20101217
- Main IPC: C23C14/35
- IPC: C23C14/35 ; H01L29/49 ; C04B35/453 ; C04B35/58 ; C04B35/645 ; C23C14/06 ; C23C14/34 ; H01L21/02 ; H01L21/443

Abstract:
A deposition technique for forming an oxynitride film is provided. A highly reliable semiconductor element is manufactured with the use of the oxynitride film. The oxynitride film is formed with the use of a sputtering target including an oxynitride containing indium, gallium, and zinc, which is obtained by sintering a mixture of at least one of indium nitride, gallium nitride, and zinc nitride as a raw material and at least one of indium oxide, gallium oxide, and zinc oxide in a nitrogen atmosphere. In this manner, the oxynitride film can contain nitrogen at a necessary concentration. The oxynitride film can be used for a gate, a source electrode, a drain electrode, or the like of a transistor.
Public/Granted literature
- US20150050776A1 SPUTTERING TARGET, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2015-02-19
Information query
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