Invention Grant
- Patent Title: Methods of manufacturing the package and light-emitting device
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Application No.: US15278724Application Date: 2016-09-28
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Publication No.: US09865779B2Publication Date: 2018-01-09
- Inventor: Tadaaki Ikeda , Masaki Hayashi , Koji Abe , Kimihiro Miyamoto
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi, Tokushima
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi, Tokushima
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2015-192683 20150930; JP2016-112963 20160606
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/46 ; H01L33/48 ; H01L33/62

Abstract:
A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.
Public/Granted literature
- US20170092816A1 METHODS OF MANUFACTURING THE PACKAGE AND LIGHT-EMITTING DEVICE Public/Granted day:2017-03-30
Information query
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