Invention Grant
- Patent Title: Electronic device with diverse antenna array having soldered connections
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Application No.: US13780787Application Date: 2013-02-28
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Publication No.: US09865915B2Publication Date: 2018-01-09
- Inventor: Boon W. Shiu , Jerzy Guterman , Mattia Pascolini
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group, P.C.
- Agent G. Victor Treyz; Michael H. Lyons
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q9/42 ; H01Q21/28

Abstract:
A wireless electronic device may be provided with antenna structures. The antenna structures may be formed from an antenna ground and an array of antenna resonating elements. The antenna resonating elements may be electrically connected to the antenna ground using solder. The antenna resonating elements may be formed from metal traces on a dielectric support structure that surrounds the antenna ground. The antenna ground may be formed form stamped sheet metal and may have slanted steps adjacent to the antenna resonating elements. To form a solder joint between the metal antenna resonating element traces and the sheet metal of the antenna ground, laser light may be applied to the sheet metal of the antenna ground in the vicinity of the solder paste. Separate metal members may also be provided in the vicinity of the solder paste and may be heated using the laser to join metal traces on plastic carriers.
Public/Granted literature
- US20140240195A1 Electronic Device With Diverse Antenna Array Having Soldered Connections Public/Granted day:2014-08-28
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