Invention Grant
- Patent Title: Sensor pad to capacitively couple to an antenna module
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Application No.: US15118586Application Date: 2014-04-03
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Publication No.: US09865927B2Publication Date: 2018-01-09
- Inventor: Ming-Shien Tsai
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc Patent Department
- International Application: PCT/US2014/032831 WO 20140403
- International Announcement: WO2015/152925 WO 20151008
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q9/04 ; H01Q5/378
Abstract:
An example computing system may include a proximity sensor including a sensor pad with a tail and an antenna to capacitively couple to the tail to increase a bandwidth of the antenna.
Public/Granted literature
- US20170062905A1 Sensor Pad to Capacitively Couple to an Antenna Module Public/Granted day:2017-03-02
Information query
