Invention Grant
- Patent Title: Printed wiring board
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Application No.: US15371212Application Date: 2016-12-07
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Publication No.: US09867292B2Publication Date: 2018-01-09
- Inventor: Hironori Ujike , Atsushi Kurauchi
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Mori & Ward, LLP
- Priority: JP2016-029661 20160219
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/18 ; H05K5/03 ; H05K7/20

Abstract:
A printed wiring board includes a first outer surface, a second outer surface, and an electronic circuit. The second outer surface is opposite to the first outer surface. The electronic circuit includes at least one specific design circuit block and at least one common design circuit block. The at least one specific design circuit block is provided on the first outer surface and designed in accordance with a specification of a device to which the printed wiring board is applied. The at least one common design circuit block is for a common use regardless of the specification of the device. The at least one common design circuit block is provided on the second outer surface.
Public/Granted literature
- US20170245369A1 PRINTED WIRING BOARD Public/Granted day:2017-08-24
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