Invention Grant
- Patent Title: Heat sink with mounted power supply
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Application No.: US15244422Application Date: 2016-08-23
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Publication No.: US09867317B1Publication Date: 2018-01-09
- Inventor: Thomas W. Jetton
- Applicant: Juniper Networks, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Juniper Networks, Inc.
- Current Assignee: Juniper Networks, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Harrity & Harrity, LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02
Abstract:
An apparatus may include a heat sink to be mounted to a printed circuit board. The apparatus may include a power supply mounted to the heat sink. The power supply may receive input power and supply output power to one or more components of the printed circuit board.
Information query
