Invention Grant
- Patent Title: Contact area design for solder bonding
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Application No.: US14584748Application Date: 2014-12-29
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Publication No.: US09871013B2Publication Date: 2018-01-16
- Inventor: Pei-Chun Tsai , Yu-Feng Chen , Tin-Hao Kuo , Chen-Shien Chen , Yu-Chih Huang , Sheng-Yu Wu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L29/40 ; H01L23/52 ; H01L23/00 ; H01L23/14 ; H01L23/498 ; H05K1/11
Abstract:
A package component includes a dielectric layer and a metal pad over the dielectric layer. A plurality of openings is disposed in the metal pad. The first plurality of openings is separated from each other by portions of the metal pad, with the portions of the metal pad interconnected to form a continuous metal region.
Public/Granted literature
- US09721918B2 Contact area design for solder bonding Public/Granted day:2017-08-01
Information query
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