A semiconductor device includes: a semiconductor element; a laminated substrate including an insulating plate and a circuit board which is arranged on the front surface of the insulating plate and on which the semiconductor element is arranged; a lead terminal provided via solder in a major electrode of the front surface of the semiconductor element; and a sealing resin for sealing the semiconductor element, the laminated substrate, and the lead terminal, wherein a value of “Young's modulus of the sealing resin×(linear expansion coefficient of the lead terminal−linear expansion coefficient of the sealing resin)” is equal to or greater than −26×103 (Pa/° C.) and equal to or less than 50×103 (Pa/° C.).