Invention Grant
- Patent Title: Pad design for reliability enhancement in packages
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Application No.: US14613997Application Date: 2015-02-04
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Publication No.: US09881857B2Publication Date: 2018-01-30
- Inventor: Jie Chen , Hsien-Wei Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L23/538 ; H01L23/544 ; H01L23/00 ; H01L25/10 ; H01L25/00

Abstract:
A package includes a corner, a device die having a front side and a backside, and a molding material molding the device die therein. A plurality of redistribution lines is on the backside of the device die. The plurality of redistribution lines includes a plurality of metal pads. A polymer layer contacts the plurality of metal pads. A plurality of openings is formed in the polymer layer, with the plurality of metal pads aligned to and exposed to the plurality of openings. The plurality of openings includes a corner opening that is elongated and an additional opening farther away from the corner than the corner opening. The additional opening is non-elongated.
Public/Granted literature
- US20150364404A1 PAD DESIGN FOR RELIABILITY ENHANCEMENT IN PACKAGES Public/Granted day:2015-12-17
Information query
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