Invention Grant
- Patent Title: Semiconductor module, bonding jig, and manufacturing method of semiconductor module
-
Application No.: US15284714Application Date: 2016-10-04
-
Publication No.: US09881890B2Publication Date: 2018-01-30
- Inventor: Kazuaki Kojima
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2014-084809 20140416
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H05K3/36 ; H05K3/46 ; H01L21/48 ; H01L23/498 ; H01L27/146
Abstract:
A semiconductor module includes an image pickup device on which a bump is disposed, and a flexible wiring board having a flexible resin as a base and including a wire having a bonding electrode at a distal end portion solder-bonded to the bump, in which the bonding electrode is pressed against the bump by bending/deformation of the wiring board caused by application of heat to a solder bonding temperature.
Public/Granted literature
- US20170025372A1 SEMICONDUCTOR MODULE, BONDING JIG, AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE Public/Granted day:2017-01-26
Information query
IPC分类:
