- Patent Title: Encapsulation structure, encapsulating method and display device
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Application No.: US15104415Application Date: 2016-02-26
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Publication No.: US09882162B2Publication Date: 2018-01-30
- Inventor: Rui Hong
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201510114389 20150316
- International Application: PCT/CN2016/074674 WO 20160226
- International Announcement: WO2016/145980 WO 20160922
- Main IPC: H01L51/00
- IPC: H01L51/00 ; H01L51/52 ; H01L51/56 ; H01L27/32 ; H05B33/04

Abstract:
Embodiments of the present disclosure disclose an encapsulation structure, an encapsulating method and a display device. The encapsulation structure includes a first substrate and a second substrate arranged opposite to each other, and a sealing structure provided between the first substrate and the second substrate. Wherein the sealing structure is provided with one or more voids, and a filler is provided within the one or more voids and includes a gas-absorbing material.
Public/Granted literature
- US20170133624A1 ENCAPSULATION STRUCTURE, ENCAPSULATING METHOD AND DISPLAY DEVICE Public/Granted day:2017-05-11
Information query
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