Invention Grant
- Patent Title: Circuit boards and circuit board assemblies
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Application No.: US14947437Application Date: 2015-11-20
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Publication No.: US09883582B2Publication Date: 2018-01-30
- Inventor: Tran Lin
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US NC Charlotte
- Agency: Locke Lord LLP
- Agent Scott D. Wofsy; Christopher J. Cillié
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L23/15 ; H01L23/367 ; H01L23/50 ; H01L23/498 ; H05K1/18 ; H05K1/11 ; G01R31/02 ; G01R31/04 ; H05K3/22

Abstract:
A printed circuit board includes a body and a belly pad seated within with the body. The belly pad is electrically separated into a first pad and a second pad. The first pad and the second pad are arranged to be electrically connected to one another by an interconnect electrically connecting the belly pad to a conductive plane of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect.
Public/Granted literature
- US20170150595A1 CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES Public/Granted day:2017-05-25
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