Invention Grant
- Patent Title: Wiring substrate for bonding using solder having a low melting point and method for manufacturing same
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Application No.: US14808275Application Date: 2015-07-24
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Publication No.: US09883586B2Publication Date: 2018-01-30
- Inventor: Tetsuyuki Tsuchida , Toshikazu Okubo , Ikuo Shohji , Akihiro Hirata
- Applicant: TOPPAN PRINTING CO. LTD. , NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY
- Applicant Address: JP Tokyo JP Maebashi
- Assignee: TOPPAN PRINTING CO., LTD.,NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY
- Current Assignee: TOPPAN PRINTING CO., LTD.,NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY
- Current Assignee Address: JP Tokyo JP Maebashi
- Priority: JP2013-013244 20130128
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K3/10 ; B23K1/19 ; B23K1/00 ; C25D7/00 ; B23K35/26 ; C22C13/02 ; H05K3/24 ; B23K1/008
Abstract:
There is provided a wiring substrate including an electrode including Cu or a Cu alloy, a plating film having a film including at least Pd, formed on the electrode, and a solder which is bonded onto the plating film by heating, has a melting point of lower than 140° C., and includes Pd dissolved therein, a Pd concentrated layer being absent between the solder and the electrode.
Public/Granted literature
- US20150334828A1 WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2015-11-19
Information query
