Invention Grant
- Patent Title: Wiring board, and electronic device
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Application No.: US14764795Application Date: 2014-07-30
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Publication No.: US09883589B2Publication Date: 2018-01-30
- Inventor: Kouichi Kawasaki
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2013-157862 20130730
- International Application: PCT/JP2014/070141 WO 20140730
- International Announcement: WO2015/016289 WO 20150205
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K1/11 ; H01L23/13 ; H01L23/498 ; H01L23/24 ; H01L23/00 ; H05K3/34 ; H05K1/18 ; H05K1/02 ; H01R9/00 ; H01L23/48 ; H05K3/24 ; H05K3/46

Abstract:
A wiring board has an insulation base plate, and a plurality of electrodes provided adjacent to each other in plan view on the insulation base plate, the electrodes have an opening in the outer periphery and a slit oriented from the outer periphery to the interior, and, among two electrodes adjacent to each other, the slit in one electrode has a central line intersecting the outer periphery of the other electrode.
Public/Granted literature
- US20150373846A1 WIRING BOARD, AND ELECTRONIC DEVICE Public/Granted day:2015-12-24
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