- Patent Title: Solder supply device including a nozzle with a piston and a demarcating member that demarcates an air chamber in which air is supplied to move the piston relative to a solder container
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Application No.: US15100499Application Date: 2013-12-05
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Publication No.: US09883597B2Publication Date: 2018-01-30
- Inventor: Akihiro Senga , Shoji Fukakusa , Ritsuo Hirukawa , Yoji Fujita , Yoshimune Yokoi
- Applicant: FUJI MACHINE MFG. CO., LTD.
- Applicant Address: JP Chiryu
- Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2013/082709 WO 20131205
- International Announcement: WO2015/083271 WO 20150611
- Main IPC: B23K3/06
- IPC: B23K3/06 ; H05K3/34 ; B05C11/10 ; B05C17/005 ; B41F15/42 ; B41F15/40 ; H05K3/12 ; B23K101/42
Abstract:
A solder supply device provided with a solder cup housing liquid solder that is tubular and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and an outer tube that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. Solder is supplied from the solder container without using an air cylinder, electromagnetic motor, or the like.
Public/Granted literature
- US20160338209A1 SOLDER SUPPLY DEVICE Public/Granted day:2016-11-17
Information query
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