Invention Grant
- Patent Title: Adjustable bending force assembly
-
Application No.: US14851970Application Date: 2015-09-11
-
Publication No.: US09883731B2Publication Date: 2018-02-06
- Inventor: Leo See Hoo Shing , Andre Sutanto
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
- Current Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
- Current Assignee Address: US WA Redmond
- Main IPC: A45F5/00
- IPC: A45F5/00 ; A45D8/36 ; A44C5/12 ; H04R5/033 ; F21V21/00 ; H04M1/05 ; A44C5/00

Abstract:
An adjustable bending force assembly is described for use with components that are securable to objects via applied bending force. In implementations, the adjustable bending force assembly is formed as part of a band that exerts bending force upon objects inserted within the band (e.g., between the ends of the band). The adjustable bending force assembly includes one or more stiffener elements that are adjustably positionable at multiple different positions along a length of the band to vary the amount of bending force. In one approach, the stiffener elements are configured as plates that slide into different positions to adjust the bending force. The adjustable bending force assembly may be included as an integrated component of a wearable device, such as a watch or headband. Alternatively, a band can be configured as a separate component to which a device can readily be attached and detached through manual force.
Public/Granted literature
- US20170071320A1 Adjustable Bending Force Assembly Public/Granted day:2017-03-16
Information query