Invention Grant
- Patent Title: Encapsulated electronic circuit
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Application No.: US14321042Application Date: 2014-07-01
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Publication No.: US09884197B2Publication Date: 2018-02-06
- Inventor: Torsten Lehmann , Gregg Jørgen Suaning , Tony Mikael Nygard , Thomas Guenther , William Lim , Kushal Das
- Applicant: NewSouth Innovations Pty Ltd
- Agency: Hauptman Ham, LLP
- Agent Martin J. Cosenza
- Priority: AU2013902440 20130701
- Main IPC: A61N1/375
- IPC: A61N1/375 ; H05K3/10 ; H05K3/02 ; A61N1/36 ; H04R25/00 ; A61N1/02 ; H01L23/055 ; H05K3/28
Abstract:
A device, including an implantable electronic circuit integrated at least one of in or on a substrate, wherein the device includes a hermetic enclosure having a space therein, wherein the substrate forms at least a portion of the hermetic enclosure.
Public/Granted literature
- US20150005573A1 ENCAPSULATED ELECTRONIC CIRCUIT Public/Granted day:2015-01-01
Information query
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