Invention Grant
- Patent Title: Molding apparatus
-
Application No.: US14789651Application Date: 2015-07-01
-
Publication No.: US09884364B2Publication Date: 2018-02-06
- Inventor: Yuji Abe , Saburo Noda , Toshiaki Toyoshima
- Applicant: Toshiba Kikai Kabushiki Kaisha
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: TOSHIBA KIKAI KABUSHIKI KAISHA
- Current Assignee: TOSHIBA KIKAI KABUSHIKI KAISHA
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Agency: DLA Piper LLP US
- Priority: JP2014-136608 20140702
- Main IPC: B22D17/04
- IPC: B22D17/04 ; B22D17/20 ; B22D17/32

Abstract:
A die casting machine has a clamping device and an injection device. The clamping device has a fixed die plate which holds a fixed die, a movable die plate which holds a moving die, an electrically operated die opening and closing-use driving device which moves the movable die plate in a die opening and closing direction, and a clamping cylinder which generates a clamping force. The injection device has a sleeve, a plunger which capable of sliding in the sleeve, an electrically operated injection-use driving device which drives the plunger at least at the time of low speed injection, and an injection cylinder which drives the plunger at least at the time of high speed injection.
Public/Granted literature
- US20160001357A1 MOLDING APPARATUS Public/Granted day:2016-01-07
Information query