A tire mountable apparatus and a method of fabricating a tire mountable apparatus is disclosed. The tire mountable apparatus includes a first layer, a second layer and a middle layer disposed between the first layer and the second layer. The tire mountable apparatus further includes an electrical device embedded in the middle layer of the tire mountable apparatus. The middle layer of the tire mountable apparatus completely surrounds the electrical device and is formed from a potting compound, The potting compound does not require exposure to heat, air, moisture, or light to clue and does not require solvent evaporation or outgassing of reaction products to cure. The tire mountable apparatus may be constructed by curing the potting compound between the first layer and the second layer.