Invention Grant
- Patent Title: Copper-based material and method for producing the same
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Application No.: US13904950Application Date: 2013-05-29
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Publication No.: US09884467B2Publication Date: 2018-02-06
- Inventor: Seigi Aoyama , Hideyuki Sagawa , Toru Sumi , Keisuke Fujito , Hiromitsu Kuroda
- Applicant: Hitachi Cable, Ltd.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CABLE, LTD.
- Current Assignee: HITACHI CABLE, LTD.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC.
- Priority: JP2012-125861 20120601
- Main IPC: B32B15/01
- IPC: B32B15/01 ; C22C9/00 ; C22C9/04 ; C25D5/50 ; C25D7/00 ; C25D3/22
Abstract:
A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.
Public/Granted literature
- US20130323532A1 COPPER-BASED MATERIAL AND METHOD FOR PRODUCING THE SAME Public/Granted day:2013-12-05
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