Invention Grant
- Patent Title: Method of manufacturing silicon single crystal
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Application No.: US14428901Application Date: 2013-11-11
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Publication No.: US09885122B2Publication Date: 2018-02-06
- Inventor: Satoshi Soeta , Shinji Nakano
- Applicant: SHIN-ETSU HANDOTAI CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-270562 20121211
- International Application: PCT/JP2013/006608 WO 20131111
- International Announcement: WO2014/091671 WO 20140619
- Main IPC: C30B15/02
- IPC: C30B15/02 ; C30B15/22 ; C30B29/06 ; C30B15/30 ; C30B15/04 ; C30B15/36 ; C30B30/04

Abstract:
The invention provides a method of manufacturing an N-type silicon single crystal having a resistivity of 0.05 Ωcm or less and a crystal orientation of by a Czochralski method, including: bringing a seed crystal into contact with a melt doped with a dopant in a crucible; forming a cone while adjusting a taper angle θ such that a ratio of the total of individual lengths of areas each having a taper angle θ ranging from 25° to 45° to length L of a cone side surface is 20% or less, where θ being formed between a growth direction of the silicon single crystal and the cone side surface when the cone is seen in a diameter direction of the silicon single crystal; and successively forming a straight body. The method can inhibit the generation of dislocations during the cone formation without reducing the yield and productivity.
Public/Granted literature
- US20150275392A1 METHOD OF MANUFACTURING SILICON SINGLE CRYSTAL Public/Granted day:2015-10-01
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