Invention Grant
- Patent Title: Methods and systems for solid state heat transfer
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Application No.: US14535770Application Date: 2014-11-07
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Publication No.: US09885502B2Publication Date: 2018-02-06
- Inventor: Sidney W. K. Yuan , Tung T. Lam
- Applicant: The Aerospace Corporation
- Applicant Address: US CA El Segundo
- Assignee: The Aerospace Corporation
- Current Assignee: The Aerospace Corporation
- Current Assignee Address: US CA El Segundo
- Agency: K&L Gates LLP
- Main IPC: F25B21/02
- IPC: F25B21/02 ; F25B21/04 ; F25B40/00 ; H01L35/32 ; F28F13/00

Abstract:
Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.
Public/Granted literature
- US20160169564A1 METHODS AND SYSTEMS FOR SOLID STATE HEAT TRANSFER Public/Granted day:2016-06-16
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