Invention Grant
- Patent Title: Thermal shock resistance testing method and thermal shock resistance testing apparatus
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Application No.: US14836072Application Date: 2015-08-26
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Publication No.: US09885616B2Publication Date: 2018-02-06
- Inventor: Takahiko Nakatani , Akifumi Kawakami , Masaaki Ito , Yuki Fukumi , Satoshi Sakashita
- Applicant: NGK Insulators, Ltd.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2014-173594 20140828; JP2015-135400 20150706
- Main IPC: G01N25/72
- IPC: G01N25/72 ; G01K7/02 ; G01J5/02 ; G01N3/60

Abstract:
A ceramic body is heated to a predetermined temperature by using a furnace, and a cooling gas is ejected toward a first end face of the ceramic body so that the first end face of the ceramic body is cooled. At this time, the temperature of the first end face of the ceramic body is measured by a radiation thermometer provided on the same side from which the cooling gas is ejected, and the internal temperature is measured by a thermocouple provided in the ceramic body. Thereafter, a thermal shock resistance test in which actual use conditions are simulated is performed by obtaining the temperature gradient of the ceramic body from measurement results of the temperature of the first end face of the ceramic body and the internal temperature and checking the absence or presence of cracks that occurs to the ceramic body.
Public/Granted literature
- US20160061758A1 THERMAL SHOCK RESISTANCE TESTING METHOD AND THERMAL SHOCK RESISTANCE TESTING APPARATUS Public/Granted day:2016-03-03
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