Invention Grant
- Patent Title: Pattern forming method, and, electronic device producing method and electronic device, each using the same
-
Application No.: US14606161Application Date: 2015-01-27
-
Publication No.: US09885956B2Publication Date: 2018-02-06
- Inventor: Tsukasa Yamanaka , Naoya Iguchi , Ryosuke Ueba , Kei Yamamoto
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-190184 20120830
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/20 ; G03F7/00 ; G03F7/039 ; G03F7/11 ; G03F7/32
Abstract:
A pattern forming method includes: (a) forming a first film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition (I) containing a resin of which solubility in a developer containing an organic solvent decreases due to polarity increased by an action of an acid; (b) exposing the first film; (c) developing the exposed first film using a developer containing an organic solvent to form a first negative pattern; (e) forming a second film on the substrate using an actinic ray-sensitive or radiation-sensitive resin composition (II) containing a resin of which solubility in a developer containing an organic solvent decreases due to polarity increased by an action of an acid; (f) exposing the second film; and (g) developing the exposed second film using a developer containing an organic solvent to form a second negative pattern in this order.
Public/Granted literature
Information query
IPC分类:
