Invention Grant
- Patent Title: Systems and methods for tool-less board to board coupling
-
Application No.: US14623218Application Date: 2015-02-16
-
Publication No.: US09886067B2Publication Date: 2018-02-06
- Inventor: Raymond Dewine Heistand , Yen-Lin Wang , Kuang Hsi Lin , Hsu-Chu Wang
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Jackson Walker L.L.P.
- Main IPC: H05K7/14
- IPC: H05K7/14 ; G06F1/18

Abstract:
In accordance with embodiments of the present disclosure, a latch may include a pivoting member and a leaf-spring member. The pivoting member may be configured to rotatably couple the latch to a chassis such that the latch may rotate between a first position and a second position relative to the chassis. The leaf-spring feature may be shaped and arranged in order to, as the latch is rotated between the first position and the second position, apply a mechanical force to a first circuit board to mate a first connector of the first circuit board to a second connector of a second circuit board.
Public/Granted literature
- US20160242309A1 SYSTEMS AND METHODS FOR TOOL-LESS BOARD TO BOARD COUPLING Public/Granted day:2016-08-18
Information query