Invention Grant
- Patent Title: High temperature superconductor wire bundling system and method
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Application No.: US14870511Application Date: 2015-09-30
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Publication No.: US09887025B2Publication Date: 2018-02-06
- Inventor: Glenn C. Driscoll , Henry C. Valcour, III , Paul Yankauskas , Daniel B. George, II , Alan W. Baum , Timothy G. Freidhoff , Bryan P. Tipton , Patricia D. Huber
- Applicant: American Superconductor Corporation
- Applicant Address: US MA Devens
- Assignee: American Superconductor Corporation
- Current Assignee: American Superconductor Corporation
- Current Assignee Address: US MA Devens
- Agency: Verrill Dana, LLP
- Agent John W. Powell
- Main IPC: H01B12/02
- IPC: H01B12/02 ; H01B12/06 ; H01B13/02

Abstract:
A system for bundling a plurality of high temperature superconductor tapes into a flexible cable, includes a first alignment device for receiving and guiding there through the plurality of high temperature superconductor tapes, each of the tapes arranged with a wide surface oriented at a first angle. There is a second alignment device for receiving and guiding there through the plurality of high temperature superconductor tapes, each of said tapes arranged with the wide surface oriented at a second angle. The first angle is transverse to the second angle and plastically deforms the tapes to impart a twist pitch in the tapes. There is a forming member spaced from the second alignment device for receiving the plurality of high temperature superconductor tapes with the imparted twist pitch and forming them into a bundle of high temperature superconductor tapes of the high temperature superconductor tapes with the imparted twist pitch.
Public/Granted literature
- US20170092392A1 HIGH TEMPERATURE SUPERCONDUCTOR WIRE BUNDLING SYSTEM AND METHOD Public/Granted day:2017-03-30
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