Invention Grant
- Patent Title: Multilayer electronic component and board having the same
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Application No.: US15222636Application Date: 2016-07-28
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Publication No.: US09887040B2Publication Date: 2018-02-06
- Inventor: Seung Hyun Ra , Yong Gyu Han
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS, CO. LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS, CO. LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2015-0172511 20151204
- Main IPC: H01G4/38
- IPC: H01G4/38 ; H01G4/232 ; H05K1/11 ; H05K1/18 ; H05K1/02 ; H01G4/005 ; H01G4/30 ; H05K3/34

Abstract:
A multilayer electronic component includes a first capacitor including a first capacitor body and first and second external electrodes disposed on outer surfaces of the first capacitor body; and a second capacitor including a second capacitor body and third and fourth external electrodes disposed on outer surfaces of the second capacitor body and electrically connected to the first capacitor. The first and third external electrodes are connected to each other by a first metal terminal enclosing portions of a lower surface of the first external electrode to an upper surface of the third external electrode, and the second and fourth external electrodes are connected to each other by a second metal terminal enclosing portions of a lower surface of the second external electrode and an upper surface of the fourth external electrode.
Public/Granted literature
- US20170162334A1 MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2017-06-08
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