An ejection inspection part of a substrate processing apparatus includes a light emitting part and an imaging part. The light emitting part emits light along a predetermined light existing plane to irradiate a processing liquid ejected from outlets of an ejection head with the light. The imaging part captures an image of the processing liquid passing through planar light emitted from the light emitting part to acquire an inspection image including bright dots. In the ejection inspection part, a determination frame setting part sets normal ejection determination frames corresponding to the outlets in the inspection image. The determination part acquires existence information indicating whether or not a bright dot exists in each normal ejection determination frame and uses the existence information to determine the quality of the ejection operation of the outlet corresponding to the normal ejection determination frame. It is thus possible to individually and accurately determine the quality of the ejection operations of the outlets.