Invention Grant
- Patent Title: IC cartridge
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Application No.: US14907748Application Date: 2015-08-27
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Publication No.: US09887114B2Publication Date: 2018-02-06
- Inventor: Yang Xing
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Collard & Roe, P.C.
- Priority: CN201510076874 20150212
- International Application: PCT/CN2015/088202 WO 20150827
- International Announcement: WO2016/127623 WO 20160818
- Main IPC: B65D85/00
- IPC: B65D85/00 ; H01L21/673 ; A45C11/24

Abstract:
An IC cartridge is provided, which includes: a cartridge body provided with hollowed-out parts, and an ejection mechanism including a substrate and projected structures which are provided on the substrate and can be slideably extended into the hollowed-out parts for pushing out IC chips; the hollowed-out parts and the projected structures cooperate to form groove structures for accommodating the IC chips. In usage, the IC chip in the groove structure are pushed out by sliding of the projected structures of the ejection mechanism through the hollowed-out parts. Thus, removing and flipping over of the IC chips is facilitated, and the processing safety of the IC chip can be ensured.
Public/Granted literature
- US20160372354A1 IC CARTRIDGE Public/Granted day:2016-12-22
Information query
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