Invention Grant
- Patent Title: Ring structure for chip packaging
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Application No.: US13227983Application Date: 2011-09-08
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Publication No.: US09887144B2Publication Date: 2018-02-06
- Inventor: Wen-Yi Lin , Yu-Chih Liu , Ming-Chih Yew , Tsung-Shu Lin , Bor-Rung Su , Jing Ruei Lu , Wei-Ting Lin
- Applicant: Wen-Yi Lin , Yu-Chih Liu , Ming-Chih Yew , Tsung-Shu Lin , Bor-Rung Su , Jing Ruei Lu , Wei-Ting Lin
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/16 ; H01L23/36 ; H01L21/56 ; H01L23/00
Abstract:
A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner.
Public/Granted literature
- US20130062752A1 RING STRUCTURE FOR CHIP PACKAGING Public/Granted day:2013-03-14
Information query
IPC分类:
