Invention Grant
- Patent Title: Semiconductor package and method of manufacturing the same
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Application No.: US15088206Application Date: 2016-04-01
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Publication No.: US09887163B2Publication Date: 2018-02-06
- Inventor: Hyun Joo Kim , Seung Hwan Lee
- Applicant: Hana Micron Inc.
- Applicant Address: KR Asan-si
- Assignee: Hana Micron Inc.
- Current Assignee: Hana Micron Inc.
- Current Assignee Address: KR Asan-si
- Agency: The Webb Law Firm
- Priority: KR10-2015-0161106 20151117
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/31 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L21/60
Abstract:
The present invention relates to a semiconductor package and a method of manufacturing the same. Specifically, the present invention relates to a semiconductor package including a substrate; a semiconductor chip mounted on the substrate; a connection element including an insulator mounted on the substrate and a first connection part of a conductive material formed at an end of the insulator; a molding part surrounding the semiconductor chip, and sealing the connection element for an upper surface of the first connection part to be exposed; and a shield layer surrounding the molding part, and forming an opening part on a part corresponding to the first connection part.
Public/Granted literature
- US20170141045A1 Semiconductor Package and Method of Manufacturing the Same Public/Granted day:2017-05-18
Information query
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