Invention Grant
- Patent Title: Integrated circuit assemblies with reinforcement frames, and methods of manufacture
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Application No.: US15165837Application Date: 2016-05-26
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Publication No.: US09887166B2Publication Date: 2018-02-06
- Inventor: Rajesh Katkar , Laura Wills Mirkarimi , Arkalgud R. Sitaram , Charles G. Woychik
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone, LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00 ; H01L25/065 ; H01L23/367 ; H01L21/66 ; H01L21/78 ; H01L23/10 ; H01L23/14 ; H01L23/498 ; H01L25/00 ; H01L21/56 ; H01L23/31 ; H01L23/04 ; H01L21/784 ; H01L25/18
Abstract:
An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.
Public/Granted literature
- US20160276294A1 INTEGRATED CIRCUIT ASSEMBLIES WITH REINFORCEMENT FRAMES, AND METHODS OF MANUFACTURE Public/Granted day:2016-09-22
Information query
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