An example method includes disposing a semiconductor element on a first surface of a substrate. The substrate includes multiple solder balls mounted on a second surface of the substrate that is opposite to the first surface. The semiconductor element includes a bottom surface adjacent to the first surface of the substrate, a top surface, and multiple side surfaces. The example method includes forming a first molding portion to entirely enclose the multiple side surfaces and the top surface of the semiconductor element. The example method includes removing a second molding portion from the first molding portion to expose all of the top surface of the semiconductor element, leaving a third molding portion entirely enclosing the multiple sides surfaces of the semiconductor element, and coupling the semiconductor element to the first surface of the substrate by forming electrical connection between the semiconductor element and a first of the multiple solder balls.