Invention Grant
- Patent Title: Semiconductor devices and methods of fabricating the same
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Application No.: US14989876Application Date: 2016-01-07
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Publication No.: US09887194B2Publication Date: 2018-02-06
- Inventor: Jung-Gun You , Sug-Hyun Sung , Se-Wan Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Ward and Smith, P.A.
- Priority: KR10-2015-0006135 20150113
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/06 ; H01L29/423 ; H01L21/8234

Abstract:
A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a fin which comprises long sides and a first short side, a first trench which is immediately adjacent the first short side of the fin and has a first depth, a second trench which is immediately adjacent the first trench and has a second depth greater than the first depth, a first protrusion structure which protrudes from a bottom of the first trench and extends side by side with the first short side, and a gate which is formed on the first protrusion structure to extend side by side with the first short side.
Public/Granted literature
- US20160204106A1 SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME Public/Granted day:2016-07-14
Information query
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