• Patent Title: Separation type unit pixel of image sensor having three-dimensional structure
  • Application No.: US14430727
    Application Date: 2013-09-24
  • Publication No.: US09887230B2
    Publication Date: 2018-02-06
  • Inventor: Jae Won Eom
  • Applicant: SiliconFile Technologies Inc.
  • Applicant Address: KR Gyeonggi-do
  • Assignee: SK Hynix Inc.
  • Current Assignee: SK Hynix Inc.
  • Current Assignee Address: KR Gyeonggi-do
  • Agency: IP & T Group LLP
  • Priority: KR10-2012-0107112 20120926
  • International Application: PCT/KR2013/008527 WO 20130924
  • International Announcement: WO2014/051306 WO 20140403
  • Main IPC: H01L27/146
  • IPC: H01L27/146 H01L27/148
Separation type unit pixel of image sensor having three-dimensional structure
Abstract:
The present invention introduces a separation type unit pixel of an image sensor having a three-dimensional (3D) structure, which is capable of maximizing transmission efficient of a charge generated through a photodiode to a floating diffusion area. The separation type unit pixel may include a first wafer on which a photodiode and a transmission transistor are formed and a second wafer on which a reset transistor and a source follower transistor are formed. In particular, the photodiode has a positive region to which an N_ground voltage is applied, the N_ground voltage having a lower voltage level than a ground voltage used in the second wafer.
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