Invention Grant
- Patent Title: Separation type unit pixel of image sensor having three-dimensional structure
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Application No.: US14430727Application Date: 2013-09-24
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Publication No.: US09887230B2Publication Date: 2018-02-06
- Inventor: Jae Won Eom
- Applicant: SiliconFile Technologies Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2012-0107112 20120926
- International Application: PCT/KR2013/008527 WO 20130924
- International Announcement: WO2014/051306 WO 20140403
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L27/148

Abstract:
The present invention introduces a separation type unit pixel of an image sensor having a three-dimensional (3D) structure, which is capable of maximizing transmission efficient of a charge generated through a photodiode to a floating diffusion area. The separation type unit pixel may include a first wafer on which a photodiode and a transmission transistor are formed and a second wafer on which a reset transistor and a source follower transistor are formed. In particular, the photodiode has a positive region to which an N_ground voltage is applied, the N_ground voltage having a lower voltage level than a ground voltage used in the second wafer.
Public/Granted literature
- US20150236065A1 SEPARATION TYPE UNIT PIXEL OF IMAGE SENSOR HAVING THREE-DIMENSIONAL STRUCTURE Public/Granted day:2015-08-20
Information query
IPC分类: