Invention Grant
- Patent Title: Scalable fixed-footprint capacitor structure
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Application No.: US14955882Application Date: 2015-12-01
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Publication No.: US09887257B2Publication Date: 2018-02-06
- Inventor: Yan Cui , Queennie Suan Imm Lim , Shuxian Chen
- Applicant: Altera Corporation
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L23/552

Abstract:
In one embodiment, a capacitor structure includes a substrate, a dielectric stack, a first conductor segment, a second conductor segment and a shielding conductor segment. The dielectric stack is formed on the substrate. A first layer of the dielectric stack includes a plurality of conductor segments routed only in a first direction. A first conductor segment among the multiple conductor segments may be biased to a first voltage. The second conductor segment among the multiple conductor segments may be biased to a second voltage. The shielding conductor segment may be biased to the second voltage and is formed at an end of the first conductor segment. In addition to that, the capacitances for the capacitor structure may be adjusted while the footprint of the capacitor structure is fixed.
Public/Granted literature
- US20170154951A1 SCALABLE FIXED-FOOTPRINT CAPACITOR STRUCTURE Public/Granted day:2017-06-01
Information query
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