An SiC semiconductor device includes an SiC layer including a drift region forming a surface and a body region forming a part of a surface and being in contact with the drift region, a drain electrode electrically connected to a region on a side of the surface in the drift region, and a source electrode electrically connected to the body region. Main carriers which pass through the drift region and migrate between the drain electrode and the source electrode are only electrons. Z1/2 center is introduced into the drift region at a concentration not lower than 1×1013 cm−3 and not higher than 1×1015 cm−3.