Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US14964950Application Date: 2015-12-10
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Publication No.: US09887298B2Publication Date: 2018-02-06
- Inventor: Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2009-270857 20091128
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/786 ; H01L21/02 ; H01L29/04 ; H01L29/22 ; H01L29/221 ; H01L29/24 ; H01L29/66 ; H01L29/26 ; H01L29/423 ; H01L29/45

Abstract:
An embodiment is a semiconductor device which includes a first oxide semiconductor layer over a substrate having an insulating surface and including a crystalline region formed by growth from a surface of the first oxide semiconductor layer toward an inside; a second oxide semiconductor layer over the first oxide semiconductor layer; a source electrode layer and a drain electrode layer which are in contact with the second oxide semiconductor layer; a gate insulating layer covering the second oxide semiconductor layer, the source electrode layer, and the drain electrode layer; and a gate electrode layer over the gate insulating layer and in a region overlapping with the second oxide semiconductor layer. The second oxide semiconductor layer is a layer including a crystal formed by growth from the crystalline region.
Public/Granted literature
- US20160163871A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-06-09
Information query
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