Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US15201493Application Date: 2016-07-03
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Publication No.: US09887301B2Publication Date: 2018-02-06
- Inventor: Hideki Makiyama
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electric Corporation
- Current Assignee: Renesas Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2015-165818 20150825
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L27/115 ; H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L21/28 ; H01L29/08 ; H01L27/11568 ; H01L27/11573

Abstract:
Performances of a semiconductor device are improved. The semiconductor device has: a gate electrode formed on an SOI layer of an SOI substrate via a gate insulating film having a charge storage film therein; an n-type semiconductor region and a p-type semiconductor region respectively formed on SOI layers on both sides of the gate electrode. A memory cell MC serving as a non-volatile memory cell is formed of the gate insulating film, the gate electrode, the n-type semiconductor region and the p-type semiconductor region.
Public/Granted literature
- US20170062624A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-03-02
Information query
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