Invention Grant
- Patent Title: Light emitting diode device
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Application No.: US12510821Application Date: 2009-07-28
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Publication No.: US09887338B2Publication Date: 2018-02-06
- Inventor: Kee Yean Ng , Siang Ling Oon , Chin Nyap Tan
- Applicant: Kee Yean Ng , Siang Ling Oon , Chin Nyap Tan
- Applicant Address: KR Seoul
- Assignee: INTELLECTUAL DISCOVERY CO., LTD.
- Current Assignee: INTELLECTUAL DISCOVERY CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Sughrue Mion, PLLC
- Main IPC: H01L33/64
- IPC: H01L33/64
Abstract:
An electronic assembly includes a Light Emitting Diode (LED) and a substrate. The LED has a solderable surface other than the contacts. The substrate has an opening. The solderable surface is mounted substantially over the opening. When the opening is filled with solder, the solderable surface is metallically bonded with the solder in the opening.
Public/Granted literature
- US20110024785A1 Light Emitting Diode Device Public/Granted day:2011-02-03
Information query
IPC分类:
