Invention Grant
- Patent Title: Thermosetting composition for organic light-emitting element filler and organic light-emitting element display device comprising same
-
Application No.: US14769291Application Date: 2013-12-27
-
Publication No.: US09887382B2Publication Date: 2018-02-06
- Inventor: Mi Sun Kim , Taek Jin Baek , Gyu Seok Song , In Jae Song , Jin Ah Lee , Seung Jib Choi
- Applicant: CHEIL INDUSTRIES INC.
- Applicant Address: KR Gumi-si, Gyeongsangbuk-do
- Assignee: Cheil Industries, Inc.
- Current Assignee: Cheil Industries, Inc.
- Current Assignee Address: KR Gumi-si, Gyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2013-0032415 20130326
- International Application: PCT/KR2013/012293 WO 20131227
- International Announcement: WO2014/157815 WO 20141002
- Main IPC: H01L51/52
- IPC: H01L51/52 ; C08K5/3445 ; C08L63/00 ; H01L51/00 ; C08G59/50 ; C08K7/02
Abstract:
The present invention relates to a thermosetting composition for an organic light-emitting element filler, which comprises (A) 100 parts by weight of an epoxy-based resin including (A1) an epoxy resin having a weight average molecular weight of around about 200 g/mol or more to less than about 1000 g/mol, (A2) an epoxy resin having a weight average molecular weight of around about 1000 g/mol or more to less than about 20000 g/mol and (A3) an epoxy resin having a weight average molecular weight of about 20000 g/mol or more to less than about 100000 g/mol, (B) about 10 parts by weight to about 40 parts by weight of a sheet-like filler and (C) about 0.1 parts by weight to about 20 parts by weight of an imidazole curing agent having a cyano group; and an organic light-emitting element display device comprising the same.
Public/Granted literature
Information query
IPC分类:
