Invention Grant
- Patent Title: Radio frequency coupling structure and a method of manufacturing thereof
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Application No.: US14473038Application Date: 2014-08-29
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Publication No.: US09887449B2Publication Date: 2018-02-06
- Inventor: Li Qiang , Olin Lee Hartin , Ralf Reuter , Ziqiang Tong
- Applicant: Li Qiang , Olin Lee Hartin , Ralf Reuter , Ziqiang Tong
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Agent Charlene R. Jacobsen
- Main IPC: H01P11/00
- IPC: H01P11/00 ; G01S7/03 ; G01S13/02 ; H01P5/02 ; H05K1/02 ; H01P3/12 ; G01S13/93 ; H05K1/14

Abstract:
A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises: a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The hole extends beyond the first wall away from the second wall.
Public/Granted literature
- US20160064792A1 RADIO FREQUENCY COUPLING STRUCTURE AND A METHOD OF MANUFACTURING THEREOF Public/Granted day:2016-03-03
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