Invention Grant
- Patent Title: Helical spring backplane circuit board connector
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Application No.: US15373693Application Date: 2016-12-09
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Publication No.: US09887475B2Publication Date: 2018-02-06
- Inventor: Garry M. Loy
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Baker & Hostetler LLP
- Main IPC: H01R13/33
- IPC: H01R13/33 ; H01R12/72 ; H01R13/24 ; H01R43/20
Abstract:
A low-cost electrical connector that is capable of providing a single or a multiplicity of continuous electrical connections between two individual printed circuit boards, and method of making thereof.
Public/Granted literature
- US20170170586A1 HELICAL SPRING BACKPLANE CIRCUIT BOARD CONNECTOR Public/Granted day:2017-06-15
Information query
