Invention Grant
- Patent Title: Hot-swappable hardware for wireless microwave links
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Application No.: US14267706Application Date: 2014-05-01
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Publication No.: US09887767B2Publication Date: 2018-02-06
- Inventor: Curtis Ling
- Applicant: MaxLinear, Inc.
- Applicant Address: US CA Carlsbad
- Assignee: MAXLINEAR, INC.
- Current Assignee: MAXLINEAR, INC.
- Current Assignee Address: US CA Carlsbad
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H04B7/26
- IPC: H04B7/26

Abstract:
Methods and systems are provided for hot-swappable hardware for communication links (e.g., wireless microwave links). A communication assembly that comprises processing circuitry may be configured to allow replacing a circuitry element during active operation of the communication assembly. The replacing may comprise configuring the communication assembly to communicate signals based on a first configuration, using the circuitry element being replaced; receiving addition of a replacement circuitry element; configuring the communication assembly to communicate signals based on a second configuration, using the replacement circuitry element; and after the communication assembly is fully configured to communicate signals based on the second configuration, removing the circuitry element being replaced.
Public/Granted literature
- US20140329477A1 HOT-SWAPPABLE HARDWARE FOR WIRELESS MICROWAVE LINKS Public/Granted day:2014-11-06
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