Invention Grant
- Patent Title: Systems for processing semiconductor devices, and methods of processing semiconductor devices
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Application No.: US14155050Application Date: 2014-01-14
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Publication No.: US09888527B2Publication Date: 2018-02-06
- Inventor: Hsiu-Jen Lin , Wei-Yu Chen , Ai-Tee Ang , Ming-Da Cheng , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: A21B1/22
- IPC: A21B1/22 ; H05B3/02 ; H01L21/677 ; H01L21/683 ; H01L23/00

Abstract:
Systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a system for processing semiconductor devices includes a radiation energy source, a support, and a tool disposable between the support and the radiation energy source. The tool includes apertures adapted to retain a package component over the support. The system includes a cooling device proximate the support.
Public/Granted literature
- US20150201462A1 Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices Public/Granted day:2015-07-16
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