Invention Grant
- Patent Title: Plasma spraying apparatus
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Application No.: US13716734Application Date: 2012-12-17
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Publication No.: US09888557B2Publication Date: 2018-02-06
- Inventor: Masanobu Sugimoto , Kenichi Yamada , Masanobu Irie
- Applicant: FUJI ENGINEERING CO., LTD. , FUJIGIKEN CO., LTD. , WEST NIPPON EXPRESSWAY COMPANY LIMITED
- Applicant Address: JP Osaka JP Osaka JP Osaka
- Assignee: FUJI ENGINEERING CO., LTD.,FUJIGIKEN CO., LTD.,WEST NIPPON EXPRESSWAY COMPANY LIMITED
- Current Assignee: FUJI ENGINEERING CO., LTD.,FUJIGIKEN CO., LTD.,WEST NIPPON EXPRESSWAY COMPANY LIMITED
- Current Assignee Address: JP Osaka JP Osaka JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Main IPC: B23K10/00
- IPC: B23K10/00 ; H05H1/42 ; H05H1/34

Abstract:
A plasma spraying apparatus includes a cathode, a first gas nozzle surrounding a head of the cathode therewith to form a first gas path outside of the cathode, and a second gas nozzle surrounding the first gas nozzle therewith to form a second gas path outside of the first gas nozzle. The second gas nozzle is formed with a wire path through which a wire is inserted such that a distal end of the wire is disposed in front of a nozzle opening of the second gas nozzle. The wire path has a substantially rectangular cross section having a longer side extending in a direction in which a plasma flame extends, the wire path causing the wire to bend within an elastic limit of the wire.
Public/Granted literature
- US20140166630A1 PLASMA SPRAYING APPARATUS Public/Granted day:2014-06-19
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