Invention Grant
- Patent Title: Flexible device including sliding interconnection structure
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Application No.: US14989921Application Date: 2016-01-07
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Publication No.: US09888567B2Publication Date: 2018-02-06
- Inventor: Seung Yeop Lee , Joo Hyun Kang , Jong Hoon Kim , Han Jun Bae
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2015-0119964 20150826
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; H01L23/538 ; H05K1/00 ; H05K1/18 ; H05K7/00 ; H05K1/14

Abstract:
A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a first sliding contact portion and a first extension portion. The second conductive pattern includes a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion. The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion. The first and second conductive patterns are embedded in the dielectric layer.
Public/Granted literature
- US20170064832A1 FLEXIBLE DEVICE INCLUDING SLIDING INTERCONNECTION STRUCTURE Public/Granted day:2017-03-02
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