Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereof
Abstract:
The cap (1) is intended to be assembled with at least one chipped element (2), said cap comprising a stack of a plurality of electrically insulating layers (1a) delimiting at least one shoulder (3) forming a part of a first groove (4) for housing a wired element (12). The cap further comprises: at least one electrical bump contact (6) arranged at an assembly surface (7) of the stack intended to be mounted on a face of the chipped element (2); at least one electrical connection terminal (5, 5′) arranged at a wall of the shoulder (3); an electrical link element (8), electrically linking said electrical connection terminal (5) to the electrical bump contact (6).
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