Invention Grant
- Patent Title: Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereof
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Application No.: US14428454Application Date: 2013-09-13
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Publication No.: US09888573B2Publication Date: 2018-02-06
- Inventor: Dominique Vicard , Jean Brun
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: FR1258687 20120917
- International Application: PCT/EP2013/068972 WO 20130913
- International Announcement: WO2014/041107 WO 20140320
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/46 ; H01L23/10 ; H01L23/31 ; H05K1/11 ; H01L23/00 ; H05K3/00

Abstract:
The cap (1) is intended to be assembled with at least one chipped element (2), said cap comprising a stack of a plurality of electrically insulating layers (1a) delimiting at least one shoulder (3) forming a part of a first groove (4) for housing a wired element (12). The cap further comprises: at least one electrical bump contact (6) arranged at an assembly surface (7) of the stack intended to be mounted on a face of the chipped element (2); at least one electrical connection terminal (5, 5′) arranged at a wall of the shoulder (3); an electrical link element (8), electrically linking said electrical connection terminal (5) to the electrical bump contact (6).
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